[Metal Etching Example] Vapor Chamber
A hollow structure for enclosing liquid, with a fin structure on the lid side to enhance heat dissipation!
We would like to introduce a cooling component that utilizes the vaporization of liquid and capillary phenomena. In this sample, a hollow structure is formed on the case side to encapsulate the liquid, and a fin structure is created on the lid side to enhance heat dissipation, using half processing, which is our specialty in etching. 【Product Specifications】 ■Material: Oxygen-free copper ■External dimensions: 80×50mm ■Thickness: 0.5mm×2 layers *For more details, please refer to the PDF document or feel free to contact us.
- Company:東洋精密工業
- Price:Other
![[Metal Etching Example] Vapor Chamber](https://image.mono.ipros.com/public/product/image/730/2000568463/IPROS46713592259205765723.png?w=280&h=280) 
 ![[Processing Example] Industrial Products](https://image.mono.ipros.com/public/product/image/504/2001016319/IPROS40170337313513230479.png?w=280&h=280) 
 