[Metal Etching Example] Vapor Chamber
A hollow structure for enclosing liquid, with a fin structure on the lid side to enhance heat dissipation!
We would like to introduce a cooling component that utilizes the vaporization of liquid and capillary phenomena. In this sample, a hollow structure is formed on the case side to encapsulate the liquid, and a fin structure is created on the lid side to enhance heat dissipation, using half processing, which is our specialty in etching. 【Product Specifications】 ■Material: Oxygen-free copper ■External dimensions: 80×50mm ■Thickness: 0.5mm×2 layers *For more details, please refer to the PDF document or feel free to contact us.
- 企業:東洋精密工業
- 価格:Other